EQS-News: AT&S and IFC sign sustainability-linked loan agreement to finance integrated circuit substrate plant in Malaysia

AT&S and IFC sign sustainability-linked loan agreement to finance integrated circuit substrate plant in Malaysia

The International Finance Corporation— a member of the World Bank Group —confirmed a 250 million US-dollar loan for AT&S to further develop the AT&S plant in Kulim, Malaysia.

Leoben, March 13, 2025 – Yesterday evening, the International Finance Corporation (IFC), a member of the World Bank Group and the largest global development institution focused on the private sector in emerging markets, and AT&S have signed a sustainability-linked loan agreement for 250 million US dollars at the AT&S headquarters in Leoben-Hinterberg. The loan supports investment in a modern integrated circuit (IC) substrate plant in Kulim, Malaysia. The 250 million US-dollar loan will come directly from IFC; an additional up to 150 million US dollars could be provided by local banks under the same agreement.

The sustainability-linked loan features financial incentives tied to AT&S lowering its annual greenhouse-gas emissions by 31 percent by the year ending March 31, 2028, compared to the baseline for fiscal year 2022.

“We are delighted to have the support of IFC as partner in our growth,” says CFO Petra Preining. “Despite a challenging market environment, we are continuing to expand our plant in Kulim; for AMD’s data center processors AT&S Malaysia will start delivering high-end integrated circuit substrates soon.”

“We’re excited to partner with AT&S on this financing, which ranks as one of the first sustainability-linked loans in Malaysia’s electrical and electronics products industry,” said Carsten Mueller, Regional Industry Director, Manufacturing, Agribusiness and Services, Asia and the Pacific at IFC. “Our investment will help to advance Malaysia’s semiconductor manufacturing ecosystem, while supporting the country in achieving its sustainability goals.”

The loan will support AT&S to further develop the new AT&S plants in Kulim, Malaysia to produce advanced IC substrates that are an integral part of processors for high-performance computing, data centers and AI infrastructure. The facilities in Kulim were built to the highest quality and sustainability standards, with state-of-the-art machinery, recycling systems and a sustainable energy concept.

IFC

IFC — a member of the World Bank Group — is the largest global development institution focused on the private sector in emerging markets. We work in more than 100 countries, using our capital, expertise, and influence to create markets and opportunities in developing countries. In fiscal year 2024, IFC committed a record $56 billion to private companies and financial institutions in developing countries, leveraging private sector solutions and mobilizing private capital to create a world free of poverty on a livable planet. For more information, visit www.ifc.org.

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft – Advanced Technologies & Solutions

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for VR and AI applications. AT&S has a global presence with production sites in Austria (Leoben, Fehring) as well as plants in India (Nanjangud) and China (Shanghai, Chongqing). A new high-end production site for IC substrates is currently being established in Malaysia (Kulim). In Leoben, a European competence center including series production for IC substrate technologies is being built. Both sites will start production in the financial year 2024/25. The company currently employs 13,000 people. For further information please visit www.ats.net